550W ｜ ZXM7-UHLDD144

The product combines 182mm large-size silicon wafers with N-type TOPCon, multi-busbar, half-cut, and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. The backside generates electricity up to 25%, it effectively absorbs the incident light in the positive side and reflected and scattered light in the back side, outputs enough power.