660W ｜ ZXM8-TPLDD132

The product combines 210mm large-size silicon wafers with PERC, multi-busbar, half-cut，and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. The bifacial layout brings greater power, and the maximum backside gain is up to 25%. This series is suitable for utility-scale power stations and distributed project.