Refresh the experience of high efficiency. The series adopts N-type TOPCon cell and features high-density packaging, enhanced reliability, non-destructive cutting and other technologies to achieve the core strengths of ultra-high power generation/ultra-high efficiency, lower LID / LETID, optimized temperature coefficient, good capture in low light effect and high compatibility.

Dual-glass module is based on 182mm large-size silicon wafers, high power, high efficiency, high compatibility, high quality and low BOS. It can reduce the risk of fire, increase moisture resistance, anti-corrosion property to acid and alkaline solution.

Refresh the experience of high efficiency. The series adopts N-type TOPCon cell and features high-density packaging, enhanced reliability, non-destructive cutting and other technologies to achieve the core strengths of ultra-high power generation/ultra-high efficiency, lower LID / LETID, optimized temperature coefficient, good capture in low light effect and high compatibility.
 

Refresh the experience of high efficiency. The series adopts N-type TOPCon cell and features high-density packaging, enhanced reliability, non-destructive cutting and other technologies to achieve the core strengths of ultra-high power generation/ultra-high efficiency, lower LID / LETID, optimized temperature coefficient, good capture in low light effect and high compatibility.
 

Dual-glass module is based on 182mm large-size silicon wafers, high power, high efficiency, high compatibility, high quality and low BOS. It can reduce the risk of fire, increase moisture resistance, anti-corrosion property to acid and alkaline solution.

Dual-glass module is based on 182mm N-type TOPCon, high power, high efficiency, high compatibility, high quality and lower temperature coefficient. It has better resistance and can reduce the probability of fire, increase moisture resistance, anti-corrosion property to acid and alkaline solution

The product combines 182mm large-size silicon wafers with N-type TOPCon, multi-busbar, half-cut, and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. The backside generates electricity up to 25%, it effectively absorbs the incident light in the positive side and reflected and scattered light in the back side, outputs enough power.

The product combines 210mm large-size silicon wafers with PERC, multi-busbar, half-cut，and improve the energy density of the module with high-density cell interconnect technology and bifacial technology. The bifacial layout brings greater power, and the maximum backside gain is up to 25%. This series is suitable for utility-scale power stations and distributed project.